Academia News
See You in Seattle
By Virgil Seaman, Co-chair, Academic PIC Division/Industry Specific, Department of Technology, California State University, Los Angeles
I want to extend an invitation to educators to join us at the upcoming COE 2003 Fall Conference & TechniFair being held at the Washington State Convention and Trade Center in Seattle, Washington.
We have been put together the Academic Track events for the Fall Conference. We are offering two breakout sessions:
Industry/Education Co-op Projects: HEAT Schools
Maury Middleton, Thomas Nelson College; C. Greg Jensen, Brigham Young University
Case studies of three industry/education partnerships providing cooperative learning experiences for students to work with industry professionals. Case studies include Thomas Nelson Community College Design Co-op and Brigham Young University. Both educational institutions are IBM HEAT (Higher Education and Training) program partners.
AC-2: The Development, Implementation, and Evaluation of DMU Training Materials
Mark Bannatyne, Craig Miller, Purdue University; John Eckholt; The Boeing Company
This presentation will discuss the development of DMU training materials for the Boeing Company by the Department of Computer Graphics Technology (CGT) at Purdue University. Information will be presented that detail the events that led up to the development of the partnership between Boeing and Purdue that ultimately led to the DMU pilot training project. The presentation will highlight the uniqueness of cooperative industry/university projects, and the learning benefits that each party experienced during the duration of the project. The full scope of the project will be shared in detail with the audience using digital examples of the developed training materials. Discussion will focus on the sharing of information between Boeing and Purdue, and suggestions offered for those who may wish to attempt developing training materials by using web-sharing technologies. Following conclusions and recommendations on the DMU project, future plans and projects will be outlined.
Be sure to attend the daily luncheons and join us at the tables marked "Academic Institutions." This is time where we can all sit down and share ideas during our busy day.
For further information about the "HEAT Program", contact information is listed below:
Q. W. (Buz) Nowicki
CATIA Higher Education an Training (HEAT) Program Manager
Product Lifecycle Management Solutions
18000 West Nine Mile Road
Southfield, MI 48075
(248) 552-5981 IBM Tie Line 896-5981 Fax (248) 552-6886
e-mail qnowicki@us.ibm.com
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