Academia News
COE 2002 Spring Conference Is Around The Corner.
By Co-Chairs: Virgil Seaman, Jefferey Maestas, Bill Abramson, Academic PIC Division - Industry Specific
Happy New Year! We want to extend an invitation to educators to join us at the upcoming COE 2002 Spring Conference & TechniFair being held in Palm Springs, California. We will have four breakout sessions at this COE. Two of the four sessions (College of Aeronautics and Purdue University) are follow-ups to presentations made at the Fall 2001 COE Conference held in Orlando, Florida. Both of these sessions were well received. The four sessions for Palm Springs are outlined for you below. We look forward to another exciting and successful conference.
| Title: | V4 to V5 Conversion: College of Aeronautics and Northrup-Grumman Corporation - Part 2 |
| Presenter(s): | Donald O'Keefe, George Kizner, College of Aeronautics, LaGuardia |
| Abstract: | This is a follow-up session to the well received presentation made at the Fall COE held in Orlando. This presentation will focus on the progress of
infusing CATIA with the curriculum and the industry-education partnership. This joint research project was initiated with Northrup-Grumman Corporation and aimed at exploring file conversion from V4 to V5. After months of work, significant progress has been made in identifying some of the hurdles as well as their solutions. The College of Aeronautics is an IBM H.E.A.T. (Higher Education and Training) program partner. |
| Title: | Infusing CATIA V5 and Team PDM into the Curriculum |
| Presenter(s): | Virgil A. Seaman, California State University, Los Angeles, Richard Cozzens, Southern Utah University, Rolando Mendez, California State University, Los Angeles |
| Abstract: | The purpose of this presentation is to show participants how to integrate
CAD and database software technology to better manage product data.
This would be beneficial for infusing the use and understanding of
databases into the curriculum, enhancing student exposure to databases
and for team/collaborative learning activities both in and out of the
classroom. CATIA V5 and Team PDM are available to colleges and
universities who participate in the IBM HEAT program. |
| Title: | DELMIA V5 Inspect |
| Presenter(s): | Roy Smolky, Educational Consultant, DELMIA, Bill Reiter, Professor,
Oregon State University |
| Abstract: | The purpose of this workshop is to show teachers how to incorporate DELMIA V5
Inspect and offline programming of a CMM. Examples of how V5 Inspect is being used at Oregon State University will be addressed. |
| Title: | Design Collaboration Utilizing ENOVIA Portal and SMARTEAM Solutions |
| Presenter(s): | Professor Craig Miller and student team Purdue University |
| Abstract: | Effective design and planning collaboration between OEM's, suppliers, and customers is crucial in assuring performance in delivering quality product. This presentation describes results of a Purdue Digital Enterprise Center project, demonstrating capability of ENOVIA Portal and SMARTEAM solutions to facilitate communication and sharing of information, including multi-CAD product models. The project scenario utilizes components of a 4-cycle motor (as presented at the Fall 2001 COE) and demonstrates how information associated with a customer-requested engineering change can be effectively shared in a collaborative environment. |
IBM-Dassault HEAT Program Create Winners in Academia and Industry
The IBM-Dassault HEAT Program is completing its fourth year. Many colleges have signed up for the CATIA software and other benefits of the program. We are all aware of the rapid changes and improvements that are taking place in the business world. One of the many improvements in the HEAT Program is the Academic Track segment of the COE organization. Many of the colleges have taken advantage of the opportunity to be part of this dynamic group, it is the perfect networking arena for industry and academia to mingle, learn and exchange ideas. Many of the schools have made presentations at COE conferences since the Fall '98 meeting when HEAT was introduced. Brigham-Young University, California State University Los Angeles, Purdue, Wichita State University, Georgia Tech and others have all made excellent contributions to the programs. Faculty and student members of the HEAT Program are active participants at the TechniFair, helping set it up and staffing a booth to show the college programs in CATIA. The COE Board of Directors have been very supportive of the Academic Track and have done a valuable service to the membership, IBM, Dassault, and the colleges.
Another "natural" partnership has evolved from the Academic Track and the COE organization. Most of the colleges in the Program are located near industrial users of CATIA, and as such are prime candidates to co-sponsor Regional Users Groups (RUGS). There are a number of RUGS that meet on a scheduled basis that allows IBM, Dassault, and Industry to meet with their local users. One of these RUGS, the Great Lakes CATIA Operators exchange (GLACOe) has been meeting every other month, since 1995, at Oakland Community College across the street from the Chrysler Headquarters in Auburn Hills, Michigan. This group meeting allows all of the CATIA users and suppliers to Chrysler to exchange ideas and suggestions, among the many topics discussed. Well over 100 people with interest in CATIA are regular attendees at these gatherings. Meetings are scheduled at COE for people interested in local RUG activities.
IBM and Dassault are "Turning up the HEAT" to help colleges stay up-to-date with the new technology. In addition to the CATIA software that has always been available through the HEAT Program, ENOVIA software is now also available. Several colleges are interested in the "Product Manager" software that is now part of the Program. Keeping up with the COE theme of CATIA-ENOVIA-DELMIA products- colleges can now obtain all three of the "Product Lifecycle Management" (PLM) solution software that is being used by the most advanced design and manufacturing companies in the world. CATIA and ENOVIA are available through the HEAT Program, DELMIA software is available on a different plan through that company.
Other topics of interest:
CATIA Student Version, we are working on this important part of the Product lineup. Please keep the information and requests coming in. "Enhanced Support Services" for CATIA V5 is now offered to HEAT members for Level 1 support. High School interest in CATIA continues to increase- recently we began to offer the HEAT Program on a selective basis, and there are several High Schools that now have CATIA.
See you all at COE in Palm Springs!
The HEAT Program for colleges (and now high schools) offers for curriculum use:
- CATIA for a nominal fee
- Free courseware
- Free training for instructors
- CBT (CATIA Companion)
- Support
- ACADEMIC TRACK at COE and registration fee discounts to HEAT members.
For further information about the "HEAT Program", contact information is listed below:
Q. W. (Buz) Nowicki
CATIA Higher Education an Training (HEAT) Program Manager
Product Lifecycle Management Solutions
18000 West Nine Mile Road
Southfield, MI 48075
(248) 552-5981 IBM Tie Line 896-5981 Fax (248) 552-6886
e-mail qnowicki@us.ibm.com
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